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Anybody ever use a TSDSON-8 package?

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AcHmed99:
I'm

amspire:
The 60C/W is with the 6cm2 copper on the drain on a 40mm x 40mm board.

I didn't see any Junction to Ambient for the device on its own.

It looks like the devices themselves are amazing - if you can cool the case down to 25 C, they can dissipate 60W!

So for 300mW, you will probably need 2 - 3 cm2 of copper on the drain, as long as the device is not right next to other hot parts.

Richard

mikeselectricstuff:

--- Quote from: amspire on October 27, 2011, 11:32:59 pm ---The 60C/W is with the 6cm2 copper on the drain on a 40mm x 40mm board.

I didn't see any Junction to Ambient for the device on its own.

It looks like the devices themselves are amazing - if you can cool the case down to 25 C, they can dissipate 60W!

--- End quote ---

Which you will of course never manage, except for very short periods.

--- Quote ---So for 300mW, you will probably need 2 - 3 cm2 of copper on the drain, as long as the device is not right next to other hot parts.

Richard

--- End quote ---
Sounds about right.
There isn't typically much difference in thermal resistance between devices in similar package sizes, so if you can find data on something similar that is better speccecd it won't be to far off. 

amspire:
I see it now. That 62C/W is a very odd spec. If it were true, then the 6cm2 of copper is almost totally useless - which I do not believe. It does look like a typo.

You really do not need much to get rid of 300mw. If you had as little as 1cm2 of copper near the device, it would probably be fine, as the copper is not just radiating the heat, but is is also dumping the heat into the bulk of the PCB. I am pretty confident that 2 cm2 would be very safe.

Richard

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