The central pad is of dubious benefit if the package doesn't have a thermal pad that can be soldered to it. You will get some thermal coupling from the package into that copper, but not a lot, since there will be an airgap that impedes conduction and the pad will have low emissivity that impedes radiation into the board. It also reduces your clearance substantially, which isn't ideal. You will get better coupling into the PCB via the leads/pads, and connecting them to chunky tracks/pours where possible will help with dissipation.
If you intend to fit a heatsink, then the second vertical part will definitely be easier, and more effective -- note that it has much lower thermal resistance figures to begin with, plus a much larger package area specifically designed for coupling to a heatsink. It will also run at a lower temperature even without a heatsink, thanks to its much larger surface area, and vertical orientation that exposes more of that area to convection.