Electronics > Projects, Designs, and Technical Stuff
BGA pad tcream design help
(1/1)
ETITsynthesizer:
I have been searching the internet for tutorials on the correct method for determining if I should use solder mask defined BGA pad footprint or if I should pull back the solder mask and use the other technique. I am also looking for information on the fenestrated pattern in tCream layer for the big square pad in the middle. I would like to read some technical papers about solder paste application thickness, min stencil opening etc.. I know some of this is dependant on the PCB fabricator. I do communicate with them. but before I go and ask them a lot of stupid questions I need some basic background information first. the design I am using now has 0.5mm ball pitch. the pads are 0.25mm diameter. the solder paste stencil (tCream) is 0.15mm diameter. the datasheet for this BGA part says 0.15mm or 0.8mm for tCream but it does not say why. they are labeled eee and fff. it does not dictate if the pads should be solder mask defined or not. point me to some tutorials or maybe even books I should buy.
Navigation
[0] Message Index
Go to full version