What is the deal with solder wicking behind the insulation if you are doing a wire splice (say with heat shrink?)
Other then being stiff in an area that you don't anticipate it to be stiff, how does the solder joint react to vibrations if the solder goes in under the insulation? I thought I read some where your not supposed to let it happen , but I am not sure why. Let's say its teflon and does not give a shit about heat. I have trouble understanding explanations like 'stress concentration'. Can someone explain graphically?
And can someone throw a number on this. Say you do a really bad job and it wicks up to 1 joint length under the insulation (so 2 joint lengths too long). And one wire that does not wick up at all. If they were put on some kind of vibration tester thing, how much faster would it fail?
For a wire joint is there a formula for solder joint length vs wire gauge vs strand count for a optimization of electrical and mechanical vibration resistance properties?