Play it safe.... You are placing this PCB inside another device. You want clearance for heat coming from that device as well.
Also, the 2.5v should have very little current. The 1.8v core probably has the higher current. And, since 1.8v is further from your 5v source, it will generate more heat.
Also, if you look at TI's data sheet for the LM1117, it has copper GND layout recommendations for the GND heatsink pad with which levels of thermal conductivity you will receive.