DDR3 Memory Packaging

[bhj99]

Hello all, I am currently looking packaging alternatives for 1 GB DDR3 memory devices in order to reduce component size, weight, and power, etc for a side proejct that is board space constrained. Most commercial BGA packaging is large (almost that of FPGA in some instances) and consumes power >1W, and I was wondering if anyone here has seen or used other advanced/smaller package size while minimizing power.

From some preliminary searched, I found that basically a company called Etron that offers a standard DDR memory product available in Wafer Level Chip Scale Package (WLCSP) and some other non-standard DDR products like Reduce Pin Count (RPC) and HyperRAM. But, other than that, I am struggling to find other companies. Any thoughts or opinions are greatly appreciated!

[SiliconWizard]

You should consider DDR3L or LPDDR3 chips. You'll probably have some trouble sourcing them, and would have more luck with LPDDR4, but if you're asking for DDR3 specifically, then I'm assuming that your design doesn't support DDR4.

[asmi]

You should consider DDR3L or LPDDR3 chips.

These two are not compatible with each other.
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On topic - DDR3/DDR3L are only available in standard 0.8 mm pitch packages as far as I know. To save power, use DDR3L signalling (1.35 V Vccio), to reduce space on PCB, use clamshell placement if it's supported by your memory controller. But if you really want to save on power, you have to look at LPDDRx standard.