Author Topic: Different die pictures  (Read 9507 times)

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Offline SYJON

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Re: Different die pictures
« Reply #75 on: March 16, 2021, 09:25:14 am »
How about 555?
 


Offline SYJON

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Re: Different die pictures
« Reply #77 on: March 16, 2021, 09:30:58 am »
Exactly! Love that  8) ;D
 

Offline Renate

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Re: Different die pictures
« Reply #78 on: March 16, 2021, 04:21:28 pm »
I hope that we'll get some good shots of eInk display panels soon.
Here is a (low quality) preview of a eInk "Carta" 300 DPI display driver chip.
A flex PC comes in from the top, the screen is on the bottom.
Between those two is an IC built on the glass.
This one has some sort of hard reflective cap stuck to it. It doesn't come off with a heat gun. Or a knife.
I have another one that has some sort of white silicone on top of the IC.
 

Offline Noopy

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Re: Different die pictures
« Reply #79 on: March 23, 2021, 04:07:48 pm »


Sensitec builds some interesting current sensors that are based on the GMR effect: CDS4000 and CFS1000 for example.
They use the compensation methode. Compensating the field of the current which you want to measure.
(pictures taken from the datasheet)




Here you see a module apparently similar to the modules used in most of the Sensitec current sensors.
The small die is the GMR sensor, the big die does the signal processing.
The black blocks are magnets that gives you an offset so you can meassure positive and negative currents.




The GMR sensor is called ADK769. With this name you find some information, for example the IEEE article "High accuracy, high bandwidth magnetoresistive current sensors for spacecraft power electronics". With the help of the IEEE article we know that the two contact on the right generate the compensation field. Us1 and Us2 is the supply of the wheatstone bridge and Uo1 and Uo2 gives you the voltage proportional to the magnetic field.





The upper dark layer conducts the compensation current. The GMR elements are under the barber pole structures.
The barber pole structures are placed directly on the GMR and conduct current quite well. That gives you an angular current flow which modifies the characteristic of the GMR element so you get a linear behaviour and more sensitivity at low fields.




Here you see the current path of the compensation current.








A wheatstone bridge is quite symmetrical and robust against noise and drifts. Nevertheless Sensitec splitted the GMR elements in four parts and mixed them together probably to get it even more robust.




On the signal processing die in the upper half there is an analog part and in the lower half is a digital part.




Hello Simon!  ;D




There are four unused bondpads and 14 (!) pads each connected to something that looks quite like a fuse.




On the right side there are the big transistors for the field compensation.
The big structures on the left side could be a voltage regulator for the wheatstone bridge.


More pictures here:

https://www.richis-lab.de/hall03.htm

 :-/O
 
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Offline Noopy

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Re: Different die pictures
« Reply #80 on: April 01, 2021, 07:39:27 pm »
One step forward in the GDR digital telephone system. We have seen the NF-Filter U1001 (https://www.richis-lab.de/phone01.htm). The next IC in the line is the U1011, a Coder/Decoder which does the digital conversion respectively the analog conversion.




The resolution of the DAC and the ADC is 13Bit. These 13Bit are compressed to 8Bit what is enough for a telephone system.






The die is 5,4mm x 3,4mm.




Looks like a revision 2...




Interesting: There are "normal" testpads and smaller testpads. I assume the smaller ones were used in development.




Nice: A Switched-Capacitor-DAC




There are three transistors, one for Ref+, one for Ref- and one vor GND.




Above the GND transistor there is a fourth small transistor connecting GND with a big metal stripe. The stripe is connected to the control circuit but most notably to a big area above the GND transistor. In the next pictures we will see that this structure somehow reduces the resistance of the transistor. I assume the additional transistor modifies the body potential.




The capacitors are the same as in the U1001.




It´s a Split-Switched-Capacitor-ADC. It is split in two halfes. The MSB-DAC contains seven segments, the LSB-DAC contains six segments. The capacitor ratio is 64:32:16:8:4:2:1 then there is a small coupling capacitor and then there is the LSB-DAC with the ratio 32:16:8:4:2:2... ...well it looks like this but I´m not perfectly sure with the ...2:2.
The transistor ratios are similar but there is a change in the ratios where the additional transistor at the GND transistor comes into play.




That looks like the output opamp.




That seems to be a bias circuit for the output opamp and the comparator of the SAR-ADC. The datasheet describes an automatic offset compensation.  :-/O




It looks like they kept an option to adjust the offset from outside the die.




With nearly the same DAC they built a SAR-ADC.




Here we have two more switches for the analog signal (because you have to switch positive and negativ potentials).




That part has to be the comparator.






Interesting: In the digital part there are some small caps integrated in the substrate. It seems like the long way to the supply bondpad had to be compensated.






The digital part is too complex to analyse every function but this looks like the 13Bit/8Bit conversion.




Digital input...




...and digital output.


Here some more pictures:

https://www.richis-lab.de/phone02.htm

 :-/O

Offline Noopy

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Re: Different die pictures
« Reply #81 on: April 08, 2021, 12:11:31 pm »




Ruhla Kaliber 15-02, a small simple digital watch.




Yeah, the battery is leaking a little.  ;D




With the small capacitor at the bottom of the board you can tune the clock.
The quartz is missing.




Here we see the contact rubber for the lcd.
They drilled two holes between the lcd and the capacitor cutting some traces. They needed this connection to galvanise the board with gold. That also a cause for the traces leading to the edge of the board.
There are some interesting dendrites at the capacitor. Perhaps because of the electrolyte?






The LCD...








They potted the controller into the PCB.
After bonding the die they took a black lid on top of the board. The bondwires get bent but it seems that was no problem.




The die is coated (2,9mm x 2,8mm).






The service manual states the controller is a KB1004CHL5-4. Probably it´s a КБ1004ХЛ5-4. Russia had a lot of clock controllers have a 1004ХЛ in their name.




A lot of the area is occupied by some similar structures, probably the lcd drivers.




There are strange structures in the middle of the die. Perhaps that is something like a mask programmed melody generator for the alarm.


https://www.richis-lab.de/clock01.htm


 :-/O

Offline Noopy

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Re: Different die pictures
« Reply #82 on: April 12, 2021, 08:05:50 pm »
As part of the GDR digital telephone system we have seen the filter circuit U1001 (https://www.richis-lab.de/phone01.htm) and the PCM-coder/decoder (https://www.richis-lab.de/phone02.htm). Now here we have the U1500PC050 which controls the signal flow.




The die is 5,9mm x 5,9mm.




The U1500PC050 is based on the Zeiss U1500. With the U1500 system you can built an ASIC out of standard cells.




Some structures to check the process quality.




The U1500PC050 was designed in the "Institut für Nachrichtentechnik".






The input bondpads are connected to the clamping diodes with a series resistor. The signal is buffered in a push-pull-stage and then reaches the internal circuit.
Around the bondpads there seems to be some kind of additional isolation.






A small push-pull output stage.






There are five bigger output stages. Different to the smaller output stages the highside and the lowside transistor are controlled with two lines. There is probably a tristate mode. That makes sense because there is also an input circuit connected to these output stages.




There is an exclusive supply bondpad at the big output stages.




In the logic block we find the same capacitors as in the U1011 (https://www.richis-lab.de/phone02.htm).


https://www.richis-lab.de/phone03.htm

 :-/O
 
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Offline Noopy

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Re: Different die pictures
« Reply #83 on: April 17, 2021, 07:34:19 pm »
Today I have a special Fluke analog switch for you. There was already a thread about it so I placed the pictures there:

https://www.eevblog.com/forum/testgear/replacement-for-fluke-700013-ic-(quad-spst-analog-switch)/msg3551343/#msg3551343

 :-/O

Offline Noopy

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Re: Different die pictures
« Reply #84 on: April 23, 2021, 08:23:15 pm »


The NEC µPD7220 is the world´s first graphic processor. The µPD7220A is the second generation.
The µPD7220AD is the ceramic package. -2 stands for the fastest version. Probably they did some binning.






The die is 4,3mm x 4,3mm. The datasheet explains that a NMOS process was used.
In the 1981 IEEE International Solid-State Circuits Conference the µPD7220 was introduced. The first generation had a die size of 7mm x 7mm. They did quite some shrinking to get to the µPD7220A.






Designed 1983...




HGDC? Some enigneers?












Some test structures...






The computer system bus and the graphic memory bus IOs are equipped with their own ground rail that is connected to the package ground with two bondwires.




And three more ground wires for the rest of the logic.




The memory blocks are easy to spot. On the right side there is the FIFO buffer (16x9) and the parameter RAM (16x8). On the left side there is the instruction ROM (128x14).


Some more pictures here:

https://www.richis-lab.de/GraKa01.htm

 :-/O
 
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Offline Noopy

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Re: Different die pictures
« Reply #85 on: May 12, 2021, 06:48:25 pm »
Here we have the next part of the GDR telephone system (https://www.richis-lab.de/phone.htm), the B384 which regulates the voltage of the subscriber's extension.




The datasheet shows the B384 as a switching regulator. The output voltage depends on the control signals RU, HR, BR.
There is a small mistake in the schematic. Can you find it? (answer at the end)
There is also an overvoltage protection circuit which activates an external thyristor with 5mA independent of the actual voltage.




The die is 4,3mm x 3,4mm. The integration density is quite low...




...that´s because the circuit has to withstand 100,25V (yes, that´s the value in the datasheet  ;D). There is quite some room between the transistors. Around the transistor structure itself there is a reddish line connected to the collector. I assume that´s some kind of potential steering to get a uniform electric field.  :-//




Some parts are integrated in squares where the distances are smaller. In these squares the voltages are lower.




There are some spare parts on the die.




Now that is interesting: There are some metal lines on the die. On one side these lines are connected to the substrate. On the other side there is a bigger area which isn´t connected to anything. I don´t know what these metal lines do!  :-//






The driver for the thyristor overvoltage protection consists of six transistors but only one of them is connected. Probably they connected the number of transistors they needed to get the right driver current. Nevertheless it´s strange there is only one of six connected.
There are two diodes (only one connected) which probably protect the base emitter junction of the driver transistor.




The driver transistors are darlington transistors.




Here we see the two power transistors and the two freewheeling diodes of the switching regulator.
Under the bondpad Ucc4 is the current limiter.
Aaaaaand the mistake in the schematic is the freewheeling diode at the bondpad L1. In the schematic it has the wrong polarity. It would create a short if the Ucc4-transistor switches.


https://www.richis-lab.de/phone04.htm

 :-/O
 
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Offline Noopy

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Re: Different die pictures
« Reply #86 on: May 16, 2021, 11:10:19 am »


Intersil ICM7045, a circuit to control a digital clock (also good for building a timer or stopwatch). The supply voltage should be between 2,5V- 4,5V. The power consumption is just 0,9mW. The ICM7045 can drive up to eight 7-Segment-LED-Displays.




The die is 3,3mm x 3,4mm.
In the centre of the die there is the logic counting the seconds, minutes, hours and controlling the display. At the edges of the die there are the big transistors that conduct the current flowing through the LED display.




ICM7045T is the internal naming of the design. As we have seen on other Intersil dies T is the revision that started at Z.
6C is the revision of the metal layer mask.
Under the metal frame we can see some other mask revisions: 1A, 2A, 3A, 5XA und 7A.




Coloring the power supply traces the location of highside and lowside drivers come into view.




Datasheet states that the ICM7045 was fabricated with a metal gate CMOS process. Here we see the metal rectangles acting as gates for the output transistors. Under the metal there are the intermeshing drain and source.






The epoxy of this older ICM7045 is a little short.  :-//






The design is the same...


https://www.richis-lab.de/clock02.htm

 :-/O
 
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Offline Noopy

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Re: Different die pictures
« Reply #87 on: May 17, 2021, 12:42:50 pm »
...
Ruhla Kaliber 15-02, a small simple digital watch.
...






They potted the controller into the PCB.
After bonding the die they took a black lid on top of the board. The bondwires get bent but it seems that was no problem.
...


I found a picture showing how the board and the ic look like before "closing the hatch":




It´s not exactly the same clock but it´s quite similar.


https://www.richis-lab.de/clock01.htm

 :-/O

Offline Noopy

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Re: Different die pictures
« Reply #88 on: May 17, 2021, 01:24:57 pm »



It´s not exactly the same clock but it´s quite similar.


Sorry, I have to correct myself: That´s an older stage of development. Here the die is on the board, not in the board. The die got potted in the next step but it´s not placed in the board.

Offline Noopy

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Re: Different die pictures
« Reply #89 on: May 25, 2021, 02:23:53 pm »
Let´s take a look into a digital audio amplifier!








TDA8920, a well known 2x110W (+/-27V, 3Ω, 10% THD) amplifier built by Philips (today NXP).
It´s a nice SMT-package with a metal plate for top cooling.




On the heatsink we have the die with some gel potting.




The die is 5,1mm x 4,2mm. We can clearly see the two channels. It´s also no problem to spot the power transistors in the lower area.






Already NXP...




The low power part is too high integrated to analyse every part of the circuit but we can see the differential inputs left and right on the upper edge of the die. The first three bondpads leading downwards left and right are VDDA, SGND and VSSA for each channel. In the middle there must be some control circuit.




Each channel has two big capacitors and two huge resistors!  :o




Well that are clearly logic lines like in a gatearray.




I assume the smaller circuits above the power transistors contain the driver and protection. It would be a logical location and the bootstrap supply ends here.




The line between the two power stages seems to contain a small power transistor. At the end of the line you have to connect the capacitor for the internal power supply. Probably that power transistor is a linear regulator.






Each Push-Pull-Stage uses six highside blocks (red/green) and six lowside blocks (green/blue). The output and the supply each use three bondwires.
At the lower edge there is the bootstrap circuit.




The power transistor structures are too small to analyse them in detail.




For the bootstrapping there is a diode connected to BOOT and leading to a exclusive VDD bondpad. The brown rectangle probably contains a low value resistor to damp the charge process of the bootstrap capacitor.
I assume the thing between BOOT and OUT is a zener to cut overvoltages at the bootstrap capacitor that can occur due to parasitic inductance at the output.


https://www.richis-lab.de/audioamp05.htm

 :-/O
 
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Offline Noopy

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Re: Different die pictures
« Reply #90 on: June 02, 2021, 06:37:43 pm »
Here we have the next part of the GDR telephone system (https://www.richis-lab.de/phone.htm), the B385, a test circuit:




Just some switches for the telephone wires. But these are interesting switches. They integrated thyristor switches which can withstand 91V, conduct 70mA and guarantee a on resistance of 17 \$\Omega\$.




The die is 3,1mm x 4,1mm.
You can clearly see the six switches and their control circuits.






To allow bidirectional current flow there are two thyristor switches connected antiparallel.
Interesting structures...


https://www.richis-lab.de/phone05.htm

 :-/O

Offline Noopy

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Re: Different die pictures
« Reply #91 on: June 04, 2021, 11:41:25 am »

Offline Noopy

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Re: Different die pictures
« Reply #92 on: June 08, 2021, 03:41:37 am »


MAX232A, a RS-232 line driver/receiver with an integrated charge pump.
The MAX232A is the newer revision of the MAX232 and needs less capacitance.




The die is 2,9mm x 1,8mm.




Built 1986.




Identifying the functional blocks is no bigger problem (sorry, german  ;)).
On the right side you have the two inputs and the two outputs.
On the left side there are the charge pumps.






At the input there is a big resistor (Ro) building a voltage divider with the resistor Ru. You can spot the lowside, the highside, the driver and the feedback circuit.








The input resistors have to be isolated better because the input voltage can go up/down to +/-25V.
The metal layer makes it possible to adjust the resistance with two fuses. With two more fuses they were able to adjust the lower resistor of the voltage divider.
The numbers seem to be mask revisions.




Here we have the lower resistor of the voltage divider, the input and the feedback resistor. The feedback resistor can be adjusted by changing the metal layer.




Between the input signal and the feedback there are two clamping diodes.




Below the RS-232-input there is the RS-232-output circuit.




Here we have the first charge pump. Four transistors switch the capacitor C1 to the +5V-supply to charge it to +5V. Then the capacitor is connected "on top of the +5V supply" and you get +10V at "V+".




In the second charge pump four transistors charge the capacitor C2 to +10V and switch it reversed to GND which gives us -10V at "V-".  :-+


https://www.richis-lab.de/transceiver01.htm

 :-+
 
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