Electronics > Projects, Designs, and Technical Stuff

DIP SMT package

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Alex Eisenhut:
Using the LOC112S

https://www.digikey.ca/product-detail/en/ixys-integrated-circuits-division/LOC112S/LOC112S-ND/654965

It is basically a DIP8 with the leads splayed out and clipped.

Here's my question, given the large size and weight of the chip, will the tiny SMT pads recommended have enough surface tension force to pull the package straight at reflow?

T3sl4co1l:
Parts about 1206 and larger, the package weight tends to dominate over surface tension.

Basically, place it right the first time. ;D

Tim

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