Quick update, not sure if it is interesting for anybody.
Before i was able to make stencils, but using 2 sheets of wet paper covering film and some efforts and tests required for each sheet, i didnt liked it, so decided to make process more predictable.
Preferably without wet paper and long process of finding right power.
What is done:
1)Upgraded my CO2 controller to smoothieware board (Cohesion 3D). Now it can eat g-codes, and not some useless for my case proprietary software and protocol from chinese vendor.
Also it has PWM control for laser power, sure within limits that CW CO2 tube can run.
2)Did slight modifications to Smoothieware, default firmware doesn't fire laser precisely (by checking code i can say offset might be +-0.05 to 0.01mm on 50mm/sec moving rate), i dont blame them at all, their software is great, but it is mostly for engraving and cutting wood and acrylic, while i need _precise_ operation for very thin film.
3)After endlessly trying various software intended to engrave and cut much more thick materials, wrote my own, crude g-code generator that swallows svg generated by kicad, generate g-code, that does stencil cutting by firing 0.1mm dots like matrix printer, and avoiding continuously (over)heating film in same place. Improving WiP.
I can't say result is everywhere better, but it is MUCH more easily reproducible and no mess with water and paper cooling, also on previous one thin separators was burned and its easy to break them while "stenciling".
Result, and 1mm ruler for comparison
Also visualization for stencil parse result(g-code will cut yellow parts), where i keep in mind laser kerf width, still heatmap visualization not done yet.