Author Topic: 0.8mm BGA package and PCB pooling services  (Read 1958 times)

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Offline homebrewTopic starter

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0.8mm BGA package and PCB pooling services
« on: August 13, 2016, 09:16:51 am »
I'm trying to design a prototype system around an ARM Microcontroller (ATSAMA5D31A-CUR). Unfortunately it comes in a 324 ball  LFBGA package. I'm not scared by BGA per se but it pushes on the limits that the standard PCB manufacturers are able to do in a pool service.

As this is my personal fun project I cannot spend a fortune on the PCB. $200 is the limit I did set myself for the PCB (4-layer).
Under this conditions the best options I could find were 0.2mm finished hole size and 0.125 mm clearance & restring.

Now to the problem: Doing a standard "dog-bone" fanout seems just not possible with these dimensions. However, pushing them a little yields the desired results. With a wire-to-via clearence of 0.117mm and a restring of 0.12mm I get pass the DRC-check.

So, this is a 6.4% deviation in the clearance and a 4% deviation on the restring.

What are my chances of getting a working board? Is it even worth trying?
 

Online Alex Eisenhut

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Re: 0.8mm BGA package and PCB pooling services
« Reply #1 on: August 14, 2016, 12:33:56 am »
Hoarder of 8-bit Commodore relics and 1960s Tektronix 500-series stuff. Unconventional interior decorator.
 
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