How much power each FET can dissipate depends on how good your heatsinking is. Sometimes you'll see a max dissipation figure in the datasheet, but as a rule these numbers are completely divorced from real-life limitations and are best ignored. Instead you need to look at the thermal resistance to the case, usually denoted as something like ?jc and measured in degrees (celsius or kelvin) per watt. You will also need to know the thermal resistance of the interface between the package and the heatsink (consult the datasheet for whatever thermal interface material you use) and the thermal resistance of your heatsink, which is a little trickier as it depends on airflow. If you need an accurate idea of your heatsink's performance, you can get TO-247 resistors with monstrous power ratings--bolting one of those to your heat sink and applying a known power to it and them measuring the temperature of the heatsink relative to ambient will give you the numbers you need. This also makes it easy to determine the impact of fan speed and so on has on the heatsink's performance.
So you should wind up with two or more terms that include the thermal resistance from the die of the FET to the case (from the datasheet), from the case to the heatsink, and from the heatsink to ambient. Since these are resistances in series, they can all be summed up to give the total thermal resistance from the die to ambient (still in °C/W). Now you need to determine the maximum operating temperature of the die (from the datasheet, and might be something like 120°C) and your maximum operating ambient temperature. If the driver will be mounted in a warm enclosure with a few other drivers, be sure to take this into account! Subtract the ambient temperature from the maximum die temperature, and divide the resulting number by your aggregate thermal resistance determined earlier. This will give you the maximum amount of power that the device can dissipate while keeping the die below its maximum temperature....in theory. In practice, you will need to include some headroom for transients and overloads, incorporate any necessary derating factors, and then add some margin for error. But you need to start with the thermal resistance calculations.