I have drawn up schematics for a USB interface on a PCB that was not populated from factory (it was used for prototyping purposes, most likely).
The specifications for the CMD 0670 chip (
http://www.bitsavers.org/components/cmd/MAN-000670-000_USB0670_673_PCI-USB_ASIC_Rev_1.8_199903.pdf, section 7.1.4) call for a Schottky diode clamp at location D2, to prevent VDD3 (+3.3V) from exceeding VDD (+5V). It says:
The USB670 has two power rails: VDD at 5.0 volts, and VDD3 at 3.3 volts. It is IMPERATIVE that the VDD3 never exceeds VDD: otherwise a latchup may occur, destroying the chip. During power-up, VDD and VDD3 may rise at the same time, provided VDD3 does not exceed VDD. In practice, limiting VDD3 to less than 0.3V more than VDD is generally acceptable if the injection current is small and of short duration. Upon power-down, it is acceptable to have VDD collapse before VDD3, provided the current through any power supply pin is limited to less than 50 mA for no more than 5 milliseconds worst case. A Schottky diode clamp may be used to ensure this if it is not otherwise part of the system design. Undershoot upon power-down should also be limited to less than 0.3V (reversed polarity) on any power supply pin. This can also cause latchup.
Here is the relevant part of my schematics:
Physical location on the board:
Full schematics also attached.
I just wanted to confirm I've got the orientation correct (anode to VDD3, cathode to VDD) – my understanding is that if VDD3 goes above VDD then any excess voltage will drain through the diode, protecting against a latchup. I also wanted to confirm a SS14 diode would be suitable here. I used some calipers to check the footprint and the DO-214AC package seems appropriate.