Easiest would be a small PCB with the edges drilled with the appropriate pin layout on 0.1in centres with the traces as needed. The package you are thinking of is the standard windowed ceramic package used for Eproms, with either a glass frit seal or a ement adhesive holding the top on. Plastic packages start off as a punched metal tape with the IC mounted on a paddle in it, with the leads wire bonded to the chip and the tabs, then the whole lot is placed in a die filled with a thermoset epoxy powder and compressed and heated till the cure time is exceeded and the chip is fixed in the package for good.
What you want is basically the common Arduino nano package, complete with the pin headers to mount it to another board. If it is to mount a chip itself then as said by Coppice the chip bonded to the FR4 and wire bonded in and blobbed in is the right thing to use.
The Kyocera package is used to convert SM devices to DIP, a very common requirement to use SM parts in military and space based applications, where the part is no longer available in DIP but redesigning the board in a SM version would either be difficult as they no longer have the original designs in readable form, or the board would need a very long drawn out and expensive recertification process, while the certification of the chip alone is a lot easier as the die and pinouts are already certified, and it is a drop in part. Price is in the dozens of dollars per unit in bulk, and it is a custom design in almost every time, basically a custom hybrid part in DIP.