| Electronics > Projects, Designs, and Technical Stuff |
| How to tent a few vias |
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| mriPaul:
I had a 4 layer PCB made and decided not to tent the vias. Now under an FFC connector, I get unwanted contact. I am getting new boards with tented vias made but it will take about 9 days due to the 4-layer design. Is there a quick fix I can use on a test board (today)? I was thinking about fingernail polish but it may be too thick. Any thoughts... |
| T3sl4co1l:
Preferably a high temperature enamel, legit soldermask stuff especially. Which isn't crazy or nasty, it's readily available, and sets with a UV LED flashlight. Also polyimide tape, which is probably still too thick. Nail polish is fine if it doesn't melt under soldering heat, which... I'd be weary about. Try it, see if it makes a mess. It may go on too thick, straight from the bottle yeah, but that's easily fixed with a little solvent, e.g. acetone, ethyl acetate. :) Spray paints of various sorts; maybe a high temperature one from the hardware store. Hm, beware of possible conductivity in black or metallic types I guess? Most should be ok though. Doesn't need to be the super temp enamel/ceramic kind, just something that doesn't melt as easily. Tim |
| mriPaul:
Thank you very much. I like the high temperature paint idea. What happened is I have a via too close to a pad. There was no solder mask bridge between the two. The pins are .05mm spacing. My usual soldering method is to drag a solder blob over all the pins and solder wick if the solder spans two pins. I will try single pin soldering. Is that possible for this spacing? |
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