Sure:
1. Reduce supply voltage (use a tracking regulator?)
2. Reduce chip or ambient temperature (or max amb spec if this is an extreme case condition)
3. Add thermal vias, use heavier copper, multilayer PCB
4. Heatsink on top
maybe helps but the package thermal resistance isn't specified
5. "Doctor, it hurts when I do this!" "Then don't do that." Get a bigger/better chip!
Wait, what the hell chip are you using, there is no MCP7383... Did you mean 73831?
There are also thermal pads with 5, even 10 W/(m.K) with a squishy durometer that a spring-loaded heatsink can conform around the parts. That'll do as well as the epoxy you describe, without the mess.

You didn't mention any restrictions on your present case, so there are a huge number of possibilities, that hold much greater promise, than simply trying to sink the heat out.

Tim