Electronics > Projects, Designs, and Technical Stuff

Is "integrated circuit burn-in" a thing?

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thermistor-guy:

--- Quote from: IDEngineer on April 23, 2019, 08:59:53 pm ---...

Several of my ongoing projects involve MEMS sensors. I'm qualifying a new (to me) one from ST, the LSM6DS3, which is very popular and very deeply stocked at multiple large distributors so they move a lot of volume. In other words, it's not some obscure part that nobody's heard of.
...

Is there anything in the industry about IC burn-in? Perhaps specific to MEMS devices in particular?

--- End quote ---


This part has a moisture sensitivity level of 3, according to Digi-Key:
https://www.digikey.com/product-detail/en/stmicroelectronics/LSM6DS3TR/497-15383-1-ND/5180534

I would check that your board assembler is receiving these parts in unbroken moisture barrier bags; or if not, that the board assembler is dry-baking these parts before assembly.

That's normally the case, but stuff-ups happen.

I can remember a case where batches of Xilinx chips were mysteriously failing. It turned out that the supplier was shipping them to our board assembler in unsealed bags. These parts had been sitting on the shelf in a humid warehouse, for months, prior to shipment. The moisture absorbed by the packages caused havoc during automated soldering. Once our Production and Purchasing people got strict about moisture sensitivity safeguards, the problem went away.

IDEngineer:
Interesting thought on the moisture sensitivity. I wonder if being powered on for a while would bake excess moisture out (for that matter, I wonder if the package is hermetic). If the problem is solely moisture interfering with a good SMT reflow, that is certainly not going to improve with power-on time.

I'll confirm with the assembly shop and report back. Thanks!

SparkyFX:

--- Quote from: IDEngineer on April 23, 2019, 08:59:53 pm ---Is there anything in the industry about IC burn-in? Perhaps specific to MEMS devices in particular?

--- End quote ---
That question reminds me of something: Have the parts been passing an X-Ray while crossing a border or such?

There are quite a few things that can damage such sensitive parts.

AndyC_772:
I know that, with some of these parts, the board layout is critical to avoid asymmetric forces being applied to the device at the point the solder solidifies during reflow. (Might be Freescale rather than ST who specify this).

What does your layout look like? Is there anything strongly asymmetrical around the device and the traces immediately leading to it?

Maybe there's some residual thermal stress 'baked' into the device after reflow, which reduces over time as the PCB pads are able to move slightly?

Whales:

--- Quote from: IDEngineer on April 23, 2019, 10:42:08 pm ---I did that, first thing (like two weeks ago). ST has stopped having formal trouble tickets and now directs you to their online forums. I have two lengthy threads there, complete with scope screenshots where applicable, but the responses I've gotten have nothing to do with my questions!

--- End quote ---

...

Customers not good enough to help directly?    Then you're not good enough for customers.

My sincere apologies IDEngineer, it sounds like they're fools.  That's not a good way of keeping customers.

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