I’m pretty sure that those series stacks (Q1, Q2, Q3) and (Q4, Q6, Q7) are about voltage sharing.
I guess ZD1 is used to indirectly set the VCE across Q1 (less the VGS of Q2 and voltage drop on R8). Perhaps there should be a connection dot near R1 and R2 so that +15VF pushes some operating current into ZD1?
R2 and R3 are I guess equal values to divide voltage across Q2 and Q3. They could be quite large because the DC current flow into C3, C4 and Q3 gate will be very small. I guess C3 and C4 are likewise equal values and a few times larger than the CGS + CDG capacitance of Q3.
Similar situation for the Q4, Q6, Q7 stack I guess.
As it comes to R8: it might actually be a set of several resistors with range switches (see also
https://www.djerickson.com/diy_smu/)
Stuff you may already know…
In principle you could use one big BJT instead, but transistors tend to have reduced power handling as VCE goes up (I think it’s called second breakdown?). This is shown on Safe Operating Area plots. Similar situation with MOSFETs too I think.
The series stack arrangement seems to use the BJT as the control device (it’s got a much more stable VBE threshold than a MOSFET VGS threshold). The MOSFETs split up and share the voltage stress (and power dissipation).
I guess the class G arrangement helps a lot in source mode, but to a lesser extent in sink mode.