I guess the lifetimes are seemingly better with through hole parts because they might be a tad larger for the size, i.e., lower energy density, higher surface area to ripple rating ratio. If I'm right on this, then it would mean if you just derate the SMD part a tad more than you would derate the TH part, the reliability would be the same.
For demanding high ripple applications, indeed choose a TH part, and that would be easier to heatsink as well with lower thermal impedance connection to multiple planes (say one full GND plane, another large Vcc pour) on a multilayer PCB.
For example, in an input of 4-channel (4-phase) synchronous buck with 12V input and 4 x 4V, 30A outputs, I obviously chose leaded electrolytics from Panasonic FR series, put enough of those in parallel, and arranged them so that they are fan cooled as well, and the first components where the cold air hits before warming up from the MOSFETs and inductors. I would definitely not do this with SMT parts, although now the polymers more affordably priced, I could consider using lower-capacitance, smaller size polymer solution with SMT parts.
And this is the important difference between standard al elcap and the polymer cap; the former is often chosen by ripple current rating (i.e., ESR) and ends up being whatever capacitance it is because it's far more than the calculated minimum capacitance anyway. With the polymer type, ripple rating being so much better, you usually use a lot less capacitance, sometimes just the minimum you calculated from charging-discharging ripple voltage equation.
But in many applications, they are just for damping or bulk storage and see very very little ripple current at all. In that case, the hour ratings at the rated extremes are not that helpful, and it's very hard to extrapolate what happens when the cap is mostly just sitting with some DC bias over it and only seeing occasional power-on current surges. No one then knows if there is any difference between a 2000 hour and 10000 hour parts.