I've used Multicore 60/40 for almost 10 years without any issues. As you know, it's Sn/Pb based and have rosin flux
at 5% at 3%.
I've got the bad idea to try the well known HS10 by Stannol. Same melting point, same Sn/Pb ratio; it have only 2.5% of rosin flux but I thought this wouldn't be a problem.
Well, now that I've tried, it seems that the HS10 behaves basically like a solder wire without flux or a solder that has been heated for too long (with all the flux burned): it tends to be sticked to the iron tip and to create sharp points when I lift the iron tip. Awful.
Sometimes it seem that I began to solder this week. 
With the multicore, my iron tip never had much tin on it (all the tin is transferred to the solder joint), with HS10 I have always a drop of solder sticked to the tip.
How can I have so much difference between this two solder wires?Any of you use HS10?