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LM399 - die analysis

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David Hess:

--- Quote from: Noopy on January 30, 2020, 10:33:41 pm ---Another interesting point is the die attach. The die is not directly bonded to the package. It sits on top of something which looks like a thinner die:

...

...the LM399 has the same "double-die"...
--- End quote ---

I suspect that was added for strain relief.  All precision analog ICs have extra packaging requirements to prevent straining the semiconductor die.

I remember an interview where I think it was Bob Dobkin who mentioned a National executive who kept complaining about the extra packaging cost of analog ICs and why couldn't they use the less expensive digital IC packaging which lacked an extra encapsulation which lowered strain.  Then later someone actually ordered that change and suddenly all of their linear ICs were failing testing and they had nothing to sell.


--- Quote from: Noopy on January 17, 2020, 09:57:59 pm ---I found a circuit that´s not in the datasheet:

...

It seems they had to do some fancy compensation.
--- End quote ---

Schematics often leave out circuits for things like transconductance reduction like common LM324 and LM358 schematics do.

Noopy:

--- Quote from: David Hess on February 09, 2020, 12:39:07 am ---
--- Quote from: Noopy on January 30, 2020, 10:33:41 pm ---Another interesting point is the die attach. The die is not directly bonded to the package. It sits on top of something which looks like a thinner die

--- End quote ---

I suspect that was added for strain relief.  All precision analog ICs have extra packaging requirements to prevent straining the semiconductor die.

--- End quote ---

Often heard about this.
It´s interesting that the "better" LTZ1000 doesn´t have a "double-die":

Richis-Lab - LTZ1000

Cerebus:

--- Quote from: Noopy on February 09, 2020, 01:26:40 pm ---
--- Quote from: David Hess on February 09, 2020, 12:39:07 am ---
--- Quote from: Noopy on January 30, 2020, 10:33:41 pm ---Another interesting point is the die attach. The die is not directly bonded to the package. It sits on top of something which looks like a thinner die

--- End quote ---

I suspect that was added for strain relief.  All precision analog ICs have extra packaging requirements to prevent straining the semiconductor die.

--- End quote ---

Often heard about this.
It´s interesting that the "better" LTZ1000 doesn´t have a "double-die":

Richis-Lab - LTZ1000

--- End quote ---

The LTZ1000A has its own proprietary die attach. This differs from the non-A version, the A version being engineered for lower thermal conductivity. It's mentioned on the first page of the data sheet.

Noopy:

--- Quote from: Cerebus on February 09, 2020, 02:18:24 pm ---The LTZ1000A has its own proprietary die attach. This differs from the non-A version, the A version being engineered for lower thermal conductivity. It's mentioned on the first page of the data sheet.

--- End quote ---

I know the LTZ1000A has a special die attach but the datasheet descripes only special thermal properties.
Of course it´s possible that it has additional special features...

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