Hi
You have (at least) three variables involved:
1) Your solder paste
2) Your applicator
3) Your stencil (material, thickness, hole size ...)
4) The pitch of your parts (solder pad size)
Yes, there are a few others, but these are the big ones. Change any one of these and you will impact your outcome. In general, the tighter things get, the more careful you have to be. Your stencil likely will get thinner as things get tighter. Your solder paste may be different for a fine pitch part (smaller particle size) than for something massive (like a SO-8 package).
Best approach - set up a frame for printing and control the tension on the stencil (regardless of the material). Index your applicator against the frame (constant pressure etc). Come up with a hold down for the board you are working on. (might be two sided tape).
There is no need to get crazy expensive with this. You can do it with junk you have lying around. Just plan on a bit of experimentation / trial and error. Once you get a formula worked out, things will repeat pretty well.
Bob