We stencil, place and reflow our own boards in-house. Occasionally something happens and we'll have some boards that are pasted or partially placed that, for whatever reason, aren't reflowed. Could be the P&P ran out of a needed part half way through a board, or reflow oven was down, or whatever.
Over time, the solder paste hardens to an something like concrete. I've tried using off-the-shelf flux to apply it to the board and thin the hardened paste, but it doesn't seem to work too well.
Any ideas on what I could do to the boards to make them usable again? I'm guessing it is just the solvent component of the flux that evaporates, so maybe soaking in IPA or something might help? Or soaking in some sort of thin (or thinned with IPA) flux? Or perhaps some kind of appropriate flux that could just be brushed or sprayed onto the boards before reflowing them?