Just an interesting paper from TI

[Terry Bites]

https://www.ti.com/lit/SLYY200

Some noteworthy stuff for those of us that like a quite psu.

[niconiconi]

One of the main approaches to reducing high-frequency emissions is to minimize the power-loop inductance.  Step-down converters from TI such as [...] move away from bond-wire packages to leadframe-based flip-chip (HotRod) packages that help lower the power-loop inductance and in turn reduce switch-node ringing

Analog Devices also has a product line called Silent Switcher 2, which also uses an improved packaging technique like TI's. In addition to low inductance footprint, ADI's packages also use embedded capacitors for low-ESL bypassing.

These certainly are great innovations, but on the flip side (no pun intended), the use of low-ESL, high density QFN and BGA packages makes an otherwise routine repair of a power supply rail become a tricky and challenging task.  But I guess any technology comes at its own cost.

[ogden]

These certainly are great innovations, but on the flip side (no pun intended), the use of low-ESL, high density QFN and BGA packages makes an otherwise routine repair of a power supply rail become a tricky and challenging task.  But I guess any technology comes at its own cost.

Do not blame manufacturers but consumers who do not care how repairable devices are and how long they last - at the time of the purchase. Manufacturers just offer what is demanded by market.