TEC-BOND 7718 and moisture (for doing hot dip)

[Psi]

So TEC-BOND 7718 is quite hydroscopic. It's an issue for glue guns because the water boils inside the gun and it drips everywhere. This is stated in the datasheet so is expected, you just have to keep the sticks dry. The datasheet also states that the performance and all tests were done on fully saturated material.

I'm wondering if anyone can see an issue having a large pot of the stuff sitting around on the production desk for occasional use, maybe in a solder pot, for dipping parts into as needed.
It would be exposed to air 24/7 so will become fully saturated, but the fact it's not in a glue gun should mean this doesn't matter much. 

But I'm a little worried if I turn on a solder pot containing cold and fully saturated 7718 the pressure under the puck might build up and throw a hot puck of tecbond across the room. hehe,  I guess there's also an issue of bubbles/foaming up.   
Any comments?  I've not tried it yet and through it make a post before trying.

I'm looking for a quick way to dip a production part that sets rapidly and adds some limited environmental protection.
(This is in a small home lab production line)

I've worked with TEC-BOND 7718 before, it's nice stuff other than having to keep the sticks dry.