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OSHW - 24bit ADC measurement system for voltage references
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branadic:
Found an intersting link today and I can't remember that it was linked somewhere on eevblog before:

Long term characterization of voltage references
rs20:
Just a thought, and feel free to point me to another thread if this has already been discussed, but the cut-outs around the voltage reference seem a bit sub-optimal? There are little PCB bridges on all four sides of the voltage reference "island", which means that that island can't freely thermally expand or contract. I don't see that thermal stresses will be reduced much at all. The suggestions in the relevant datasheet, to have a cut-out running continuously around all three sides of the reference so that it's freely cantilevered in space seem more effective and more space-efficient.
branadic:
Please refer to the video available by Linear Technology (Brendan Whelan) that suggest this 4-sided cutout geometry to give similar or better performance compared to the 3-sided pcb tab cutout:

http://www.engineeringtv.com/video/Linear-Technology-LS8-Package-I (watch minute 6:34)

Furthermore you have the advantage of running the traces over the corners instead of having all traces at one side. So, I preferd using the 4-sided cutouts and while the device runs within +10°C ... +40°C I'm not affraid of any form of cutouts.
rs20:
Point taken, although I can't reconcile this with my intuition. Interesting that the context was FR4 swelling due to humidity. I'd be curious if anyone's come across some actual studies on this -- all the video tautologically says is "A can give similar or better performance than B", which doesn't rule out A being better than B at all.

</ot>
Andreas:

--- Quote from: rs20 on July 06, 2014, 07:08:30 am ---Point taken, although I can't reconcile this with my intuition. Interesting that the context was FR4 swelling due to humidity. I'd be curious if anyone's come across some actual studies on this -- all the video tautologically says is "A can give similar or better performance than B", which doesn't rule out A being better than B at all.

</ot>

--- End quote ---

You are invited to do some studies on this.
I for my part prefer the "dead bug in hole mounting" method for LS8-devices. (do not try this in production).
https://www.eevblog.com/forum/projects/ultra-precision-reference-ltz1000/msg278825/?topicseen#msg278825


A other method would be mounting the reference on a ceramic substrate with the same CTE than the housing of the reference.
Or using a flexible part of a PCB (kapton foil) for the mounting of the reference.

With best regards

Andreas
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