I have been making PCBs at home. I am using pre-sensitised photoresist PCBs. They are covered with a thick black film to protect from light. The photoresist is green n colour. I have two types, single sided and double sided. I peel off the protective film, expose the board with UV light, and then develop in the photo resist developer. The development process removes the areas which have been exposed to the UV light leaving the rest untouched. It is easy to tell because the photoresist is green, so it is obvious when the development process works, and when it does not.
My problem is that even though the developer specifies 30 seconds at 18-22 C, it takes more than 60 seconds to remove the resist from the single sided boards and sometimes even 120 seconds to remove the resist from one of the two sides of the double sided boards. As the board has to stay in the resist for so long, some areas of it end up being removed as well, lines and pads become thinner.
Since the two sides of the board usually behave differently, or at best they both require so much time to be developed that areas which should be left alone also get affected, I am putting this down to bad quality of photo-resist. I do not know what else to suggest.
Any ideas?