Author Topic: Transistors - die pictures  (Read 269493 times)

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Offline NoopyTopic starter

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Re: Transistors - die pictures
« Reply #925 on: September 07, 2024, 05:54:00 am »


You can see it here. That´s not just a window in the passivation.
(https://www.richis-lab.de/Bipolar60.htm)




...or here...
(https://www.richis-lab.de/Bipolar59.htm)


I have done IR pictures and they show IR light exactly in this area. It all makes sense.


Someone has sent the part to me. I don´t know the history but it doesnt look like a fake to me.
 
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Offline NoopyTopic starter

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Re: Transistors - die pictures
« Reply #926 on: September 10, 2024, 03:07:11 am »


BDX66, now built by Philips. Same specifications...






The package contains a very large die on a large heatspreader.






The edge length of the die is 5,0 mm. The surface appears to be dirty in the top left-hand corner.




The MESA trench has been inserted extremely cleanly into the die.




As shown in more detail for the MJ3001 (https://www.richis-lab.de/Bipolar60.htm), a line runs as a resistor across the left-hand side of the die from the base to the emitter of the power transistor. The unusual contact area at the lower edge is interesting...


https://www.richis-lab.de/BipolarA65.htm

 :-/O
 
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Offline NoopyTopic starter

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Re: Transistors - die pictures
« Reply #927 on: October 20, 2024, 06:06:14 pm »
The germanium crystal documented here comes from the estate of Professor Heinz Beneking. Professor Beneking was one of the first to carry out research and teaching in the field of semiconductor technology in Germany. He worked at the RWTH Aachen.




The germanium disk was certainly cut from a longer crystal pulled from a melt. This slice was then cut horizontally and vertically to produce rods of the same size. Some of the rods were broken out of the crystal. As will become clear, it must be germanium.




The crystal comes with the paper shown here. According to this, transistors should be made from it.




A comparison with a CR2032 button cell shows that the crystal disk is not very large.




Over time quite some dirt has accumulated in the gaps.




The dimensions of the rods are 0,6mm x 0,6mm x 1,8mm. The surface is surprisingly smooth. Perhaps the surface was etched after sawing. This would make sense, as impurities and dirt on the surface can have a negative effect on the properties of the later transistors.




The fifth edition of the “General Electric Transistor Manual” explains what is behind the term metlback. It is a lesser known method of creating an NPN transistor. In principle, the process works with both germanium and silicon, although it was usually used with germanium crystals.

First, n and p doping are introduced into a germanium crystal so that the n doping is dominant. The crystal is cut into rods, attached with one side to a heat sink and heated until the other side melts. If the melt is allowed to cool, it first recrystallizes slowly at the still solid area and then increasingly faster towards the end. The incorporation of n and p dopant atoms depends in part on the speed of crystallization. Gallium, which is usually used as a p-dopant, is hardly influenced by the speed of recrystallization. Antimony, which is usually used as an n-dopant, builds up more strongly in the crystal structure the faster the crystallization takes place. This physical effect ensures that a layer is formed on the non-melted rod that has a dominant p-doping, while the n-doping predominates again in the remaining area. This results in the desired NPN structure.




In the book “Getting Started With Transistors”, Lous E. Garner shows what a transistor with a so-called meltback junction usually looks like.




However, the term meltback is also used in another context. Robert Widlar is the author of a training document entitled “Transistors”, which was used in the “Department of Weapons Training Lowry Air Force Base Colorado”. The fifth chapter of this document describes another way to create NPN transistors. This involves pulling a germanium crystal from a melt containing n- and p-dopants, with the n-dopant (antimony) dominating. By increasing the temperature of the melt, the growth rate of the crystal can be reduced. The physical relationship described above then ensures that the p-dopant dominates in this area.

If the temperature of the melt is increased a little more during this process, part of the crystal that has already been produced melts again. As a result, the transition to the p-type semiconductor, which occurred when the temperature was first increased, melts again and an advantageous, more abrupt transition occurs. This process is also referred to as meltback. The germanium crystal handed down by Professor Beneking is certainly the variant in which the germanium rods still have to be melted. This is clear due to the paper which describes that transistors should be built by meltback.


https://www.richis-lab.de/BipolarA66.htm

 :-/O
 
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Offline NoopyTopic starter

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Re: Transistors - die pictures
« Reply #928 on: October 23, 2024, 05:58:21 pm »


These five transistors also come from the estate of Professor Heinz Beneking.






The bag was wrapped in a two-page measurement protocol. All five transistors were measured in detail. The measured values are recorded in the protocol.




Each transistor has a hand-labeled band with the serial number. The transistor with the number 1297 is documented in more detail below.




The first thing you notice in the package is the poor quality of the bond connections on the pins.






The edge length of the die is approximately 0,5mm. The cut edges are very irregular. The surface is also very inhomogeneous.


https://www.richis-lab.de/BipolarA67.htm

 :-/O
 
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Online RoGeorge

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Re: Transistors - die pictures
« Reply #929 on: October 23, 2024, 06:29:08 pm »
Nice!  I wonder how much (or if) they changed with time.
Have you tried to re-measure any of those parameters?

Offline NoopyTopic starter

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Re: Transistors - die pictures
« Reply #930 on: October 23, 2024, 06:38:24 pm »
Since the structures are quite rude it is very likely the specifications suffered during the decades. But I didn´t do measurements. I urgently need a SMU.  ;D

Offline NoopyTopic starter

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Re: Transistors - die pictures
« Reply #931 on: October 26, 2024, 02:59:50 am »




The last transistors from the estate of Professor Heinz Beneking. There are five transistors in a plastic box. The sticky label reveals that these are npn transistors based on gallium arsenide. Gallium arsenide makes it possible to achieve significantly higher switching frequencies compared to silicon.




The transistors are labeled with a letter and one or two numbers. The label describes an operating point at 3V and 3mA for each transistor.




The marking appears to have been applied by hand.




There is a bondwire on the bottom of the package. It can be assumed that the transistor was bonded by hand.




The edge length of the die is approximately 0,65 mm. The large lower contact transfers the substrate potential and thus the collector potential. The contours of the base and emitter areas can just be seen in the middle of the die. Test structures appear to have been integrated in the upper third.


https://www.richis-lab.de/BipolarA68.htm

 :-/O
 
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Offline NoopyTopic starter

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Re: Transistors - die pictures
« Reply #932 on: November 23, 2024, 08:28:27 pm »


The TF65 is an early germanium transistor that was originally developed by Siemens. The model shown here was produced by the German company Intermetall. There is no datasheet from Intermetall. Siemens offered several types, including a TF65 and several TF65/30. The maximum blocking voltage of the TF65/30 is 10V. The maximum permissible collector current is 50mA. Up to 30mW can be dissipated via the housing. Amplification factors from 20 to 100 can be distinguished using six color codes. Red stands for an amplification factor of 20 to 30. The TF65 without the addition 30 is not sorted according to amplification and allows a slightly higher reverse voltage of 16V. However, the maximum permissible power dissipation is 5mW lower than for the TF65/30.




The package contains a gel. Such fillings usually have two functions. They protect the transistor from environmental conditions and support the dissipation of power loss to the housing.




The transistor is constructed like most alloy transistors. A metal strip carries a 0,13 mm thick n-doped germanium disk, which is contacted on both sides with a solder. The solder usually contains indium, which is alloyed into the germanium to create a p-type doping.






The germanium crystal has a diameter of 2,1mm and it is broken in several places. The construction was not mechanically stressed when it was opened. The reason for the destruction could have been an electrical overload. Such an overload can heat the germanium crystal to such an extent that the thermomechanical stresses burst it.




The surface of the germanium crystal shows the typical structure that often occurs during etching. The crystal was obviously etched even thinner in the direct vicinity of the contact. The surface structure is also smoother there.


https://www.richis-lab.de/BipolarA69.htm

 :-/O
 
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