Your confusion confuses me (I am easily confused). Everything depends on the characteristics of the pad, and of the interface between the pad and materials A and B.
When the thermal conductivity of the pad/paste/whatever is orders of magnitude lower than that of materials A and B, your confusion is not so confusing. Because then indeed the first order of business is to get a reaaaally thin film in there. Because in this case the goop is the biggest contribution to thermal
resistance.
However when the thermal conductivity of the pad is en par with or even high than that of materials A and B, this rule of thumb is not all that applicable. Then it is not so much the thickness of the stuff, but purely the quality of the interfaces.
Reading back, not sure if I explained it all that well, but we can only hope...
Edit: Heh, I see Rufus beat me to it. 
And yes, I tried to find that in the datasheet as well. GRRRR. With this stuff your main concern becomes the surface interfaces, aka how well it conforms to the tiny bumps in your materials A and B. And also, how stable this interface is over time.
Regardless, I am suitably impressed by the price level of this stuff. Now if only we could get some customer option dopants in it for a small price increase I'd be pleased as punch.
