| Electronics > Projects, Designs, and Technical Stuff |
| really proper way to apply thermal compound? |
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| Mr. Scram:
This discussion seems to reappear over and over and never seems to be conclusive. There are a few popular camps with have valid points on paper, but which in practice don't seem to make any distinguishable difference. Pick what works for you and be happy with it. |
| GregDunn:
--- Quote from: Nerull on December 10, 2018, 04:09:05 am ---People obsess over methods of thermal compound application but real word differences seem minimal to non-existent. --- End quote --- This. If it were really important, they wouldn't give thermal compound, CPUs and heat sinks to gamers and trust them to not screw it up. |
| Mr. Scram:
--- Quote from: GregDunn on December 10, 2018, 06:00:59 am ---This. If it were really important, they wouldn't give thermal compound, CPUs and heat sinks to gamers and trust them to not screw it up. --- End quote --- I suspect the typical demographic of the target group is a large part of the ongoing discussion. Teen men with a point to prove aren't quite known for their nuanced discussions and factual opinions. |
| coppercone2:
whats interesting about CPU is the fact that you can replace the paste between the die and the lid of the IC in a modern intel chip to improve its performance. surprising for 1000$ ic. but seriously, what about spin coating? Its used for extremely even distribution of photoresist during transistor manufacture. |
| jbb:
In the high power semiconductor line, screen printing a pattern of small diamonds (or similar) on seems to be common. For Some systems (eg automotive) we are starting to see devices which have fins or pins for water cooling built right into the bottom plate. No heatsink compound anywhere! |
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