Electronics > Projects, Designs, and Technical Stuff
really proper way to apply thermal compound?
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Mr. Scram:

--- Quote from: wraper on December 10, 2018, 08:34:02 pm ---Because it was newly applied thermal paste and there was an air bubble. When you are dissipating 250W of heat at 95oC die temperature over 4cm2 without any heatspreader, it matters.

--- End quote ---
That's a bit anecdotal to be honest. By reinstalling the heatsink you change many variables. Maybe the pressure or mounting was different, who knows.
wraper:

--- Quote from: Mr. Scram on December 10, 2018, 08:37:16 pm ---
--- Quote from: wraper on December 10, 2018, 08:34:02 pm ---Because it was newly applied thermal paste and there was an air bubble. When you are dissipating 250W of heat at 95oC die temperature over 4cm2 without any heatspreader, it matters.

--- End quote ---
That's a bit anecdotal to be honest. By reinstalling the heatsink you change many variables. Maybe the pressure or mounting was different, who knows.

--- End quote ---
You cannot make a different pressure with that heatsink and springy backplate on the opposite side. Pressure applied is a constant amount, period. And how pressure would matter to begin with? And I say it again, there was a freaking air bubble when I disassembled it  :palm:.
EDIT: And that graphics card would not go over 95oC which is target temperature. It would increase fan speed and throttle.
langwadt:

--- Quote from: TERRA Operative on December 10, 2018, 05:30:27 am ---A good way to ensure even coverage and exclude air is to apply the thermal paste in an 'X' pattern then clamp the heatsink on.
This will make sure the thermal paste reaches the edges but won't capture air.


--- End quote ---

yeh just like when laying tiles using a notched trowel always make parallel lines so you don't get any closed pockets of air 
coppercone2:
people will desolder their processor lids and snap off glue with special jigs. look at the process on youtube, I have seen a high end AMD processor go into a pizza/toaster oven.
Mr. Scram:

--- Quote from: wraper on December 10, 2018, 08:58:52 pm ---You cannot make a different pressure with that heatsink and springy backplate on the opposite side. Pressure applied is a constant amount, period. And how pressure would matter to begin with? And I say it again, there was a freaking air bubble when I disassembled it  :palm:.
EDIT: And that graphics card would not go over 95oC which is target temperature. It would increase fan speed and throttle.

--- End quote ---
I don't have trouble believing that you saw an air bubble upon disassembly. The issue is the implied causation based on a single uncontrolled observation. That's tentative in the best of circumstances and probably worse in a matter where discussions tend to be endless in lieu of hard repeatable evidence.
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