So the IGBT in the machine I am servicing now appears to be a press fit assembly. Its held on through 2 screws into a nylon holder to press it into a PCB with pads that are covered in solder it looks like.
this IGBT blew up and looking at the mechanism its really weird.
https://www.semikron.com/innovation-technology/packaging-technology/press-fit-technology.htmlIs this popular? is this good? Its filled with telephone company goo.
My IGBT is not the same as the article, it actually is a SMD device, it has pins much like the new multimeter 9V pins, that press into the exposed solder pad contacts (I think thats what they are). Yes, a big press fit SMD device, no plated through holes required.
I noticed also, two of the many pads have arc damage, since I ordered a new IGBT, is there anything to watch out for in preparing this contact surface for a new IGBT module? I am kind of thinking arc damage at contacts is a bad sign for this technology...
I have this one specifically,
https://www.semikron.com/innovation-technology/packaging-technology/skiip-technology.htmlCould this be the reason why the welder failed? Arcing contact maybe caused some problems.. I would say "well lets solder it on", but get this, its a 3 piece assembly,
so
the semiconductor is press fit into the spring, that press fits into a FR4 PCB board, and its all held together by two screws in the middle to make a sandwich. So if you even did solder it yourself some how, there is still ANOTHER mechanical connection inside the module, so the IGBT has TWO contacts per PIN. Its a 600V 6A unit.
My plan is to clean up the pads with alcohol and grease lightly and place in the new iGBT.
It happened to blow up right where the logo is, so I recommend putting two inscriptions on large power components, I had to put the pieces back together with tweezers like sherlock holmes to read the part # lol