Depends on thermal conductivity, part size, etc.
Which, the trip point itself depends critically on the same, so, expect a wide range of currents, and sharp derating at high ambient temperature, especially varying with amount of copper connecting to the pads, airflow, board temperature and nearby heat sources, etc.
I tend to avoid ground plane underneath chip polyfuses for this reason.
I don't know that the polymer crystallization takes much time, but that might be a factor as well, materials can supercool and remain amorphous, only crystallizing more slowly. Or if cooled below the diffusion activation temperature, never.
Operation in general is slow, as the active volume is much greater than that of a metal-element fuse, and the permissible fault power isn't very high either -- typically you see maximum current ratings say 10 to 100 times nominal, and the maximum voltages are usually low (10s). Whereas a common 5x20mm fuse might be rated 1kA or more breaking current. The slowness means quite a lot of energy let-thru, making them even worse at protecting semiconductors for example. (That said, thanks to the low voltage, it is possible to design circuits to withstand such conditions.)
There are higher voltage types BTW, which are based on a ceramic composition. The on/off ratio is smaller, they're lossier I think? But handy when that's all you need.
Tim