For amateur or one-off boards, consider using a modified skillet method.
I've had success using a saucepan with sand in the bottom and a glass lid, plus a non-contact thermometer. The sand heats the board first (i.e. before the components), acts as a thermal buffer preventing hotspots, and allows controllable temperature rises. The glass lid keeps a little heat in, thus heating the topside components a little, and allows you to see the solder melting so that you can carefully lift the board when it has melted. I've found thin lifting wires hooked through holes on the PCB corner are necessary and sufficient when removing the PCB.
As with any new technique, a little experimentation will enable you to control the rate of temperature rise just by turning the gas up and down.