What to assume when a datasheet doesn't specify how to clean after soldering?

[oneil]

I'm getting a board manufactured that has a BMD-340-A-R (BLE module). The board house is asking me if it can be aqueous cleaned.

I never gave a thought to whether or not it could be. The datasheet doesn't mention anything about cleaning after assembly. I've tried reaching out to the manufacturer, u-blox, to get a definitive answer one way or another. I also posted on their forum. No bites on either and it's been days.

Looking at datasheets of other parts I frequently use, e.g. battery protection ICs from TI, battery chargers, etc. I don't see any recommendation on cleaning.

In these cases, am I same to assume that aqueous cleaning is okay? Curious to hear what you think

[Conrad Hoffman]

Given the non-hermetic shield, that doesn't look like something that can be washed or cleaned at all. It might have a trimmer cap as well, so I'd say be safe and use a process that doesn't require cleaning.

[oneil]

I will say that the shield is almost deliberately non-hermetic. There is plenty of clearance between the components and the metal shield over them. You can look through one side and see out the other. I took the shield off to inspect the components underneath: the nRF5240, some passives, and a crystal (that I tore the top of the package off of). See picture.