When the part was initially introduced is probably a big factor. Older ICs like the TL08x that were introduced a while ago might be introduced in whatever package is most popular at the time then, if they're popular enough, moved to more modern packages while retaining the old ones for compatibility with existing customer designs -- and in this case, since opamp pinouts are generally well standardized, they maintain interchangeability with other parts that way too.
SSOP is half the pitch of SOIC, so would be notably more difficult to assemble in older times -- less so now, which is why it's more common for newer parts. Improvements in assembly technology plus drive for more compact electronics reduces demand for the larger parts, hence why the MCP33151 might only be available in SSOP rather than SOIC. The industry is still progressing, so now more parts are in leadless and even chip scale packaging, but those are still more challenging/expensive to assembly, so there's still plenty of market for the SSOPs. Or if you're wave soldering, you still probably want SOIC rather than SSOP, but you probably wouldn't be wave soldering anything complex enough to need an ADC.
More complex parts might be limited by their die size, so in some cases a smaller package may only become available late in a part's lifecycle after a die shrink.