Author Topic: Tenting Vias to Reduce Thermal Pad Solder Starvation  (Read 639 times)

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Offline HenryMTopic starter

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Tenting Vias to Reduce Thermal Pad Solder Starvation
« on: February 15, 2020, 12:58:36 pm »
A board we recently sent out for production had some tented vias in a thermal pad under two separate ICs. One of the IC's had 10mil hole vias and the other had 30 mil hole vias. They asked for clarification basically saying that surely we didn't want any of those tented as we had a fab note indicating that the tented vias did not need to be plugged, so why even tent them?

The 30 mil holes I understand, those can't really be tented reliably. I asked them to use a 10 mil drill there instead and leave the tenting in place in all vias where specified in the gerbers.

So, my question is, does tenting a 10mil hole via found in a thermal pad underneath an IC accomplish anything? Or would the solder just bridge across the hole and go no where.
 


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