EEVblog Electronics Community Forum
Electronics => Projects, Designs, and Technical Stuff => Topic started by: RobEE on May 12, 2017, 11:38:12 am
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I am looking for a way to do a thermal analysis of an electronic system to determine if the heat dissipated by the electronics will be enough to require additional cooling to prevent the electronics from going above their max rated temperature. If I have a rack (not a 19" rack, but custom racks/shelving) filled with electronics, and I know the power requirements for each electronic box and data on each boxes internal fan (if it has one), and the rack is exposed to ambient air; is there a way to determine the temperature rise around the boxes from the heat they dissipate? How would this change if the rack was enclosed? Or only partially enclosed?
I work for a small company so we can't afford any expensive thermal analysis software, or a full-time thermal engineer. We are looking for a way to at least do a ball-park thermal analysis. Any help will be greatly appreciated.
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You might try the free student edition of Quickfield. There have been some thermal analysis articles in EDN and other places over the years, with the earlier ones having some programs and formulas. Probably impossible to find now was the March 1985 issue of Electronic Packaging & Production, pg. 80-84 by Paul R. Conigliari. It had an error, but I have the corrected basic code that could easily be ported to VB or something. PM me if you want it.