Can you give an example of the power being removed from the potential divider leg on such a frequent basis? Everyone else around here seems to not know of this technique in practice and thinks it's of little benefit.
I do it in a battery management system, where every single li-ion cell powers a microcontroller. I don't use a separate MOSFET, but just an IO pin directly on the low side. The arrangement is:
Vcc --- 470R --- ADC input --- 120R|100nF --- IO pin. Low resistor values provide good noise margin and low impedance for the ADC, as well as quick charging of the filter cap (which also helps with the impedance). There is a 5 ms delay after powering the divider so that the capacitor is charged.
The IO pin trick does add a source of error that isn't negligible, but everything is software-calibrated anyway with offset, gain and temperature compensation (the MCU has an internal temperature sensor).
Quiescent current consumption less than 50 µA was an important design goal, and this was the easiest way to achieve it - with zero extra components. This is the simplest distributed cell-level BMS with the smallest BOM I can imagine, and the specs are still quite good.
I guess I could have done it with high enough divider values to obtain < 50 µA divider current, and then just use large enough cap (100 nF probably OK) to filter any noise and provide the low-impedance source for the ADC. On the other hand, the switchable low-resistance network provided me an alternative way to burn excess charge (cell balancing) without extra components.