I wonder if the risk go down if you reflow them after hand soldering.
No - the ceramic has cracked and is unrepairable. (This "delamination" is similar to cracking, only in different direction than "typical" MLCC cracking.)
It's just worth noting that the effects of the cracks often become apparent only over time. Sometimes a slightly cracked capacitor works 100% fine for months or even years before wreaking havoc.
I still can't figure out what the difference with hand soldering is?
I think we are not told the whole story. "Hand soldering" is to wide of a term and not the thing to blame. They should blame the inccorect soldering processes involved.
They should be at least more specific.
This is pretty basic stuff, very well known today, you'll find a
lot of references and almost all MLCC manufacturers simply recommend against any hand soldering process as a blanket statement, for very good reasons.
I guess this NASA study doesn't provide more "basic" details since this stuff is already discussed elsewhere; for example in numerous other NASA reports. They discuss some interesting details of this specific type of MLCC cracking, aimed at people who are already familiar with MLCC cracking in general.
I guess, "hand soldering" really refers to soldering done using a soldering iron and the "tack one pad down, then the other" method. The paper also discussed hand solder
rework, which would make sense - for example, I received some boards lately that required such rework since I had messed up the capacitor footprint (just used a footprint supplied with the PCB package without checking, "to save time" - the most basic beginner mistake

), which caused the capacitors to drift in the reflow (luckily not tombstoning), necessitating manual resoldering of the unconnected pad.
The problem with hand soldering is the quick and uneven heating and cooling profile of the capacitor. Also, the soldering iron tip temperature is typically some 50-100 degrees C higher than the comparable reflow process, which is necessary because of dT losses in manual soldering process - but these losses do not always happen and are unpredictable. Hence, manual soldering easily gives 100 degrees higher peak, with 10 or even 100 times quicker heating rate, and all the heat is supplied through one end of the capacitor.
Thermal shocks are simply something surface mount MLCCs can't handle too well. Almost any type of "manual soldering" I can think of produces these shocks, hence any type of manual soldering is not recommended.
(Still, we all
do solder them manually every day. But we must understand that this is an informed choice of taking the risk. Completely OK prototyping one-offs that live on the lab table for a few months. Not OK for large production or mission-critical stuff.)