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| Vapour phase Soldering |
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| jeremy:
Ok, I'm very interested. Anyone up for a group buy? |
| ElektroQuark:
The necessary quantity of liquid can be minimized if the bottom side of the pot is narrow. The heater could be immersed in the fluid in that end. As the beaker wides, the PCB size can be bigger. |
| ajb:
I'm curious about the post-processing steps. How much of the working fluid winds up on the board by the end of the process? Presumably at that price point you want to recover every drop from the finished board! If a rinse is required , is it as simple as rinsing with distilled water or alcohol, then using a low heat cycle to boil off the rinse and recover the working fluid? |
| IconicPCB:
Main problem with vapour phase is tombstoning due to an imbalance of thermal properties of the design. This is assisted by slightly more inert atmosphere in the vapour cloud compared to IR/ convection oven. I am presently looking at a new USD6000 vapour phase unit versus a laser soldering robot for those pesky double sided jobs. |
| jeremy:
--- Quote from: IconicPCB on January 20, 2015, 10:30:25 pm ---Main problem with vapour phase is tombstoning due to an imbalance of thermal properties of the design. This is assisted by slightly more inert atmosphere in the vapour cloud compared to IR/ convection oven. I am presently looking at a new USD6000 vapour phase unit versus a laser soldering robot for those pesky double sided jobs. --- End quote --- According to this guy: http://www.kemet.com/Lists/TechnicalArticles/Attachments/28/f2102a.pdf tombstoning can be minimised by proper preheating. If you do end up buying one, please sell me some galden! ;D |
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