| Electronics > Projects, Designs, and Technical Stuff |
| Vapour phase Soldering |
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| mrpackethead:
--- Quote from: Chris Jones on December 04, 2015, 10:52:22 am --- --- Quote from: mrpackethead on December 04, 2015, 03:52:01 am ---Im just getting back into this project again as the crazy time of the year has passed. I got an email from Hawker Richardson, and they are selling 5kg of Galden LS215 for $AUD 1225 on their web store. Thats a resonably cost effecitve price. I want 2.5kg, anyone interested in splitting a bottle with me? ( I figure in my device, i'll probalby only need about 1kg ).. --- End quote --- I'd prefer the 230 degree stuff - used it at work with lead free paste and turned out very well. Due to the finely divided particles that I seem to get everywhere, I'd prefer not to use leaded paste at home if the lead free works well. Chris --- End quote --- They are also selling the 230, as well, its a little more expensive, but still the cheapest option in A/NZ. Interested to know what your experience of "divided particles is". |
| Chris Jones:
--- Quote from: mrpackethead on December 04, 2015, 08:44:07 pm ---They are also selling the 230, as well, its a little more expensive, but still the cheapest option in A/NZ. --- End quote --- Thanks. Unless someone is doing a group buy I'll leave it until I have the time to build the rest of the thing, and/or lose access to the machine at work. --- Quote from: mrpackethead on December 04, 2015, 08:44:07 pm ---Interested to know what your experience of "divided particles is". --- End quote --- By "finely divided" I just meant that the solder paste contains very small particles of solder, in comparison to most of the solder blobs that result from hand soldering. I suspect that smaller particles would be more difficult to clean up and more likely to get ingested unless significant precautions are taken. My only experience with (lead free) paste is that I made quite a mess of the bench, though the boards turned out very well. |
| IconicPCB:
The finer the particles the more problematic the paste. A major problem is the shelf life of paste. major contributor to lack of shelf life is ratio of ball surface area to volume of solder ball. As the ball size reduces the ratio of surface area ( for area read solder dross.. oxidized solder) versus ball volume ( read healthy virgin alloy material)increases providing for a joint with possible dross inclusions. |
| Koen:
Hello, I read the thread (but couldn't watch the videos) and couldn't find an answer to this question : in a homemade setup, Galden in a cooking pot for example, at which point is the PCB inserted ? Is it placed above the liquid Galden before heating up so the PCB will slowly warm up with the air ? Or is it dipped after the Galden turned to vapor and if so, is the PCB warmed up on the side before to avoid a thermal shock ? Thank you, Koen. |
| helius:
It doesn't much matter which order, since heating only happens in the zone of condensing vapor. As a practical matter, the PCB is lowered into position first, and then heat is supplied to move the vapor zone up over the PCB, because tighter control of vapor is achieved. |
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