Can't this type of reflow be achieved using less expensive liquids?
Can't this type of reflow be achieved using less expensive liquids?
Can't this type of reflow be achieved using less expensive liquids?
I would look at a convection oven using circulating hot air. Air is cheap and easily obtained, and the circulation currents lead to even heating and good heat transfer.
A possible design could include an electric hot air gun as a heat source and a triac dimmer for temperature control. The hot air gun comes with its own fan, so you only need to put together a suitable insulated enclosure with a window and some suitable baffles for good circulation. The temperature sensor could be placed in the exhaust port and measure the air temperature leaving the oven.
Sorry Ian, but have you read the whole thread?
One of the benefits of VP is the inert atmosphere of the vapour, the main reason to investigate this technology.
Is stainless steel really a requirement?
I mean if fluid is inert it ought not contribute to corrosion process in any way.
Why does it need to be stainless steel why not ordinary galvanized sheet metal ?
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Actually Ian has a fairly good point I think.
If you have a large vessel with at the bottom a controlled oven heated 230QuoteoC area filled with Argon gass (which is heavier than air so will stay at the bottom) it would still be a matter of slowly lowering the pcb inside the area till the temp profile is correct.
Only problem I see is that hot air rises up so you have less controlled heating profile unless you let the pcb slide in from aside instead of above but then you have chance of loosing Argon.
We need a mechanical engineer here to sort this out
For a hobbyist to buy and keep an Argon supply on hand will cost more than the litre of Galden.
For a hobbyist to buy and keep an Argon supply on hand will cost more than the litre of Galden.
Air, density about 1.2 Kg m3, Argon about 1.6 Kg m3, galden ht230 has a molecular weight of about 1000, so ~26kg per m3
I think the argon will be superfluous.
For a hobbyist to buy and keep an Argon supply on hand will cost more than the litre of Galden.
Air, density about 1.2 Kg m3, Argon about 1.6 Kg m3, galden ht230 has a molecular weight of about 1000, so ~26kg per m3
www.g-werner.at/de/downloads/solvay_solexis_galden.pdf
The process is extremely fast and efficient since the
heat transfer coefficient of vapor condensation is
about ten times (10x) faster than hot air and about
eight times (8x) faster than infra red heat.
Air, density about 1.2 Kg m3, Argon about 1.6 Kg m3, galden ht230 has a molecular weight of about 1000, so ~26kg per m3
I think the argon will be superfluous.What do you exactly mean, superfluous? Google translation says "not necessary", but the argon prevents the oxydation if you use simple hot air reflow and do not use galden. Yes if you use galden Argon is useless.
For a hobbyist to buy and keep an Argon supply on hand will cost more than the litre of Galden.Good to see that not everybody gets raped on industrial gas pricing like we do in NZ.
Bottle hireage ~$120/year
Re-fillable bottle purchase $500 up
2 m3 fill ~$80
Hence the reason behind my statementAir, density about 1.2 Kg m3, Argon about 1.6 Kg m3, galden ht230 has a molecular weight of about 1000, so ~26kg per m3
www.g-werner.at/de/downloads/solvay_solexis_galden.pdf.
So what is an educated estimate of the m3 of vapour from 500ml of Galden?
Cause you can't see the stuff, how big might a suitable vessel need to be?
Or is this of little concern as it will be ALL temp controlled?
From the datasheet linked above:QuoteThe process is extremely fast and efficient since the
heat transfer coefficient of vapor condensation is
about ten times (10x) faster than hot air and about
eight times (8x) faster than infra red heat.
Doesn't that fascinate you, it does me.
I have been searching "vapour phase soldering" in Google for more than an hour, but I still haven't found answer to one question:
At what step is the solder put onto the PCB?
I watched many Youtube videos (there wasn't any close up one). They put the PCB solderless PCB inside the hot cloud. And when they take it back, there are solders on the pads. Where did that solder come from? The boiling liquid doesn't contain any solder as far as I understood.
Can you please clarify this?
I have been searching "vapour phase soldering" in Google for more than an hour, but I still haven't found answer to one question:
At what step is the solder put onto the PCB?
I watched many Youtube videos (there wasn't any close up one). They put the PCB solderless PCB inside the hot cloud. And when they take it back, there are solders on the pads. Where did that solder come from? The boiling liquid doesn't contain any solder as far as I understood.
Can you please clarify this?
They use solder paste, when it reaches the melting point the components stick with the surface tension of the solder.
Some more data, that i was able to obtain tells me that;
The Distillation spec range of the HT230.
10% > 210C, 90% < 250
Compared to the LS which is
10% < 222, 90% < 235