Author Topic: Via stitching for high current on multiple power and ground planes  (Read 547 times)

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Offline OwenHTopic starter

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Hi,

I am working on a design using an microcontroller controlled infineon Profet +24 to switch a power bus at 14v - 23v at 10 amps.  The PCB is a 4 layer board with 2oz copper on the outer and 1oz copper on the inner layers.  At the output of the power switch I have 2 power planes and 2 ground planes to handle the current. The output is to an edge board connector on the lower right side of the PCB as seen in the images.  The edge board connector uses the top pins for power and bottom pins for ground.

My question is whether it is best to use stitching vias for both the 2 power and the 2 ground planes between the power switch and the connector? or is it better to add vias only at the connector and the switch as shown on the images?

I imaging I have enough copper to accomplish this with just the top layer and the bottom layer but it seemed to me it would be better to use all 4 layers since I already have them and it should help with thermal dissipation of the Power profet switch.   

Any advice is greatly appreciated!

Owen 

 
 

Offline ejeffrey

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I would put them just at the connector and switch as shown.  Vias in the middle wont carry much if any current anyway and will just create holes in your power planes that increase resistance.  They might help a bit with cooling the inner layers, but at only 10 amps over 3 oz copper and what looks like a fairly short and wide run I wouldn't worry about that.
 
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