Hi:
Why the two and what are the pros and cons of either. Also I notice the CL spec varies from about 8pF to about 30pF, is this just a manufacturers design/process, or is there a specific reason for large differences, and what is my consideration if I want to use either to clock say a PIC, AVR or other?
As an educated guess, I would say that the
style of Cut (bar, plate, or 'tuning fork' shape), package profile (flatter 4-pad = lower and sturdier, narrower 2-pad = less real-estate and less sensitive to board flex), stray capacitance, designer preference, intended use, Temperature Coefficient curve, & etc. all come into play, and more.
Technology plays a big role, too -- time was when crystal "holders" were the size of your two thumbs, side by side, the 'slab' inside was larger than your thumbnail.
... for example cpu data sheet for the stm32f103 gives a recommended load capacitance of 30pf, but several of ST's designs use a crystal to clock the same micro with a data sheet spec of 8pF?, and then recommend a CL in the range of 5 to 25pF? (page50 from Doc ID 13587 Rev 11 September 2009)
Physics, and resonant circuit theory and practicalities. The range is there because AIUI, it is: a) Hard to control, b) Has limited effect, c) Capacitors have wide tolerances, d) Except in precision systems, who wants to Pay for 0.001 % without the need?
Plus, the I/O pins on a uP are not all that well-characterized or controlled.
ETA: If you want to get closer to 'Spec', you can parallel a ceramic trimmer cap.
GPS? Use Caesium, Rubidium, or OXCOs, because it Matters.
Heart rate monitor? Use a decent crystal, but heartbeats aren't stable, and move around every beat.
LED flasher or microwave oven timer uP? Who would ever POSSIBLY know or care? Use a 20% resistor and a +100/-25 % cap @ 500KHz. Will it matter?
Hope this was useful.
Cheers,
Dave