EEVblog Electronics Community Forum
Electronics => Projects, Designs, and Technical Stuff => Topic started by: Alpejohn on May 08, 2017, 07:36:23 pm
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Hi,
Hope this is the correct place to ask! If it fits better under other categories, maybe the admins would be so kind to move it. ^-^
Im woring on a bluetooth ibus aux adapter for my bmw e39 03 model.
Where i want to skip tracks on my phone when playing music, from my steeringwheel.
I have made everything work with arduino uno, prototyping board, bluetooth module and a ibus adapter.
Now im working on getting everything on the same PCB, to save space and maybe get everything in a box.
So im working with Autodesk Eagle to make the board.
But i cant find any stuff in the library that will fit the BT module. So i started making my own.
Seems to work great, but i got an error where it tells me that all pins are connected.
Because the pads are centered in the outer line of my part. But i think it has to be this way.
I have attatched a few pics to show the problem.
Basically i want to have a surface like the blue board where i can mount my BT module. (waiting for a CSR8630 bt module)
Does anybody got a some tips on how i can make the library part work?
As i am still learning im struggeling to find a solution.. :)
Thanks!
Best Regards
Fredrik
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it's because you CONNECTED all your pins ;) the part outline has to go to different layer, you drew it on the TOP layer as wire electrically connecting all pads.
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Yeah, i can see they are connected, but the guide i was following didnt say anything about that. ;D
And as its my first library i just did what i thought was right. ;D
I thought that when i was drawing the part, it did not end up as i wire, but a drawing.. So i didnt think much about it..
Other chips and stuff has the connection pin on the outside right? So they wont get this problem?
I will try to edit and make it on a second layer. Thanks! :)
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look at this VSSOP i created... pads go to TOP layer outline goes to TDOCU layer.
(https://www.eevblog.com/forum/projects/what-have-i-done-wrong-when-making-my-autodesk-eagle-library/?action=dlattach;attach=314118)
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Aaa..
Let me try and see what i can do. :D
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enjoy and good luck ! ;)
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Woha! I think i made it!
The error is gone to! :D
Thanks! Learned something new! :)
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:-+
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Your top outline/stencil is printed over the SMD pads. Depending on PCB manufacturers, they might print the white box silkscreen right on-top of where you want to solder. If I were to alter that component, I would trace out the box with lines, same layer, same size, beginning and ending just outside of the SMD pins, then remove the rectangle box, leaving the same box, just without paint on-top of the SMD pins.
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Your top outline/stencil is printed over the SMD pads. Depending on PCB manufacturers, they might print the white box silkscreen right on-top of where you want to solder. If I were to alter that component, I would trace out the box with lines, same layer, same size, beginning and ending just outside of the SMD pins, then remove the rectangle box, leaving the same box, just without paint on-top of the SMD pins.
that's a good point ! :-+
i'm making my own boards without silkscreen (2 layer boards with solder masks but no silkscreen), so i don't care about tdocu in the manufacturing phase - for me the TDOCU is just a guideline on the monitor screen during layout.
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Your top outline/stencil is printed over the SMD pads. Depending on PCB manufacturers, they might print the white box silkscreen right on-top of where you want to solder. If I were to alter that component, I would trace out the box with lines, same layer, same size, beginning and ending just outside of the SMD pins, then remove the rectangle box, leaving the same box, just without paint on-top of the SMD pins.
Im not sure i understand what you mean, i dont know the program that good, Im just trying and failing to find out how things work.. :)
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Talking bout the silkscreen. If you want the outline to be printed in a silkscreen, you will have to move it. Silkscreen will act like stop mask right in the middle of your pads, if you were to put that layer in your gerber silkscreen layer. Big problem. No worries. Just doublecheck which layers you want to be in the silkscreen in your CAM job settings and make sure that this outline is not in one of those layers.
It is more the norm than the exception to have a layer like this, such as Rob77's TDOC layer. I'm sure they would come back to you with engineering inquiry if you were to present that as a silkscreen, lol.
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Okay, is it better now? :)
Seems to work good! And the pads are still at the same spot so i would think this is ok. :)
Maybe you guys know what i have done wrong in the symbol to? I named all the pins, and then when i placed it on my schematic it appeared with
the text double.. When i first named all the pins, the name was on the outside of the symbol, but then suddenly the names came on the inside to..
So now it kind of looks like a mess :palm:
You wouldnt happen to know what i have done wrong? ;D (added a pic)
Also, does it matter what type of pins i use on the symbole? Could i have used the normal circle with a line coming out of it? Like a normal pin?
Or does it really matter? The importent thing is that the pads where the actual module is gong to be soldered? :)
I really appreciate your help! :-+