Well, if you use a 100µm thick stencil (my favorite thickness, I prefer it over 120µm now), doesn't that kind-of set a maximum limit on the solder thickness?
In reality, the paste layer has deliberate gaps in it (segmentation) spreading the paste over larger area (reducing thickness), and the flux also gasses and/or flows out of the mixture, so I would expect the end result is significantly thinner than the original paste print thickness. But you can't go wrong if you assume the worst and calculate using stencil thickness.