Thanks for helping. Ive made some more changes to the schematic ive made and corrected a few issues so it may make better sense.
Ive also found out the zener diode value and some of the other capacitors that were testing bad so ive ordered replacements along with IC4.
im assuming when you say to concentrate on the 400v side you are referring to the cluster i am working on at the bottom of the board, is that correct? Or should i be focused on the top of the board? Up there everything looks as it should but i haven't tested TR2 for functionality.
Out of curiosity, i have some blue thermal pads i got off eBay, are they sufficient for using on TR3 to the aluminium outer case or do i need a thermal grease? what's recommended? here's the details of what i have already.
100x100x1mm Thermal Pads for use with Laptops, PC, XBOX OR PlayStation
0.5mm Easily cut to Size to fit your application
High Performance Thermal Conductivity 6.0W/mk
Specific Gravity: 2.85 g/cm3
Hardness: 30 Shore C
Continuous Use Temp: -40~+220 ºC
Dielectric Breakdown Voltage: >5 Kv
Tensile Strength: 55Kg/c㎡
Dielectric Constant: 5.5ºC-in2/W
Volume Resistivity: >3.1*10″Ω.cm
Flame Rating: V-0
Thermal sink, insulation, pressure endurance, stickiness, fill in, Anti-vibration.