These things are tiny, so they must have an equally tiny thermal mass.
It's my understanding when soldering through hole or surface mount ICs, you want to go carefully on the legs: skipping every other one as you go so as not to heat a single part of the chip too much. Even regular through passive components, the rule of thumb is no more than 2-3 seconds of heating.
It's also my understanding that heat (with time) kills these components, especially capacitors. It's why you want your electronics well ventilated, you don't want things running at a million degrees forever.
Well in comes repair and rework of SMD components, especially stuff like hot air: literally oven bake the entire chip until it's hot enough that it melts the solder around it and to it. Even with regular soldering, the thermal mass of these chips is so small, just sticking a soldering iron and melting solder onto it, I don't see how that little component doesn't entirely heat up to the solder melt temperature.
Now let's add lead-free solder that bumps the required temperatures up another 100°F or so.... are these components simply designed to handle these temperatures? If I have an SMD capacitor going in with lead-free solder, basted in flux, am I to understand that I can simply bake the whole thing until it sets with no harm no foul?
Are there industry norms/standards on this? I don't get it.