I don't know what is going on with the OP and I don't much care - if he wants to come back and has an interest in getting help, that would be great. If not, that is his choice....and it would be hard to get help if you are that "autoreactive".
I don't want to start a big argument, but here is the problem I have with the situation.
My own experience is that I never hold the iron on there for 60 seconds or even 15 seconds. Plenty of flux, tin the tip, soldering tip on the pad, hit it with the solder and it flows right away, and that's it - maybe 3-5 seconds. As I said, I don't ever recall toasting a chip for over heating - if it gets bricked, it is because I did something else wrong and that I, eventually, figured out what it was that I did wrong. I am usually using a carrier board for smt and have hand soldered several SOIC8 and even a few smaller.
These are the 'Absolute Maximum Ratings' from the data sheet.

Now, I am not saying, speak to me like I am a 5 year old, or whatever that ^%$#ing acronym is, but instead, speak to me like I am not an EE (I'm not). But, I just looked at some chips that I did solder and I don't see one with a soldering temp AMR that low.
Do you really want to say that Absolute Maximum Ratings can simply be ignored? Do they just make up crap and put it in there - of course not and I don't think that you would say as much.
Nevertheless, he reported using a soldering iron temp significantly higher than the AMR. Granted, I may not appreciate the qualifications of "vapor phase" and "infra red", but I can see when one temperature is above another.