Are you saying that you delidded a soldered IHS, replaced the solder with paste, and were then able to achieve lower die temperatures?
Probably I should had explained better: This procedure was only done on Intel CPUs, since AMD uses a proper soldered die to the heatspreader. There are users who delid the AMD CPU and gained temps of 2
oC, so not worth the time spend, Although Intel is were the biggest gains are. A 9900K just delid, clean the solder and change to thermal paste, you earn 5
oC at OC 5GHz All Cores:
My use case:
The Soldered ones the solder was scraped and replaced with Liquid Metal. That CPUs were mostly used in direct die cooling, so no heat spreader. The Thermal pasted ones were clean and applied better thermal paste. That ones were reinstalled the heat spreader on them. So yes in direct die cooling with liquid metal is were you get the best performance. Also forgot to say that I also done some under voltage to try to find the minimum voltage needed for the CPU to run at his Turbo Settings without crashing.
There are enough examples on Reddit r/Overclocking or even Youtube Videos with the full testing and temperatures. Unfortunately there aren't that many who Delid and do undervolting. Mostly of the videos available the delid is for overclock. My objective was to reduce temperatures of the CPUs without using water cooling since it were for production PCs that could not stop and I could not afford a leak in a watercooling loop. Knowing that Air is a worse thermal interface than Water, I put everything on the table to get as low as possible on air. Stability over Performance, that was what I wanted.
Regarding liquid metal and the danger of the same flowing and shorting the surface mount components on a CPU (and GPU too, by the way) just cover said components with thermal paste. No need to do a conformal coating, although is the correct way of doing it.